Wafer Reclaim/Reclean
Services
We have the capabilities to process 100mm, 125mm, and 200mm wafers.
List of Services
- Full Reclaim
- EPI Reclaim
- Strip & Clean
- Double Side Lap
- Specialty Processing
- Virgin Test Wafers
- Applications Engineering
- Inventory Mangement Services
Polish
Remove EPI, oxides, photoresist or any other films you may need removed.
Lapping
Double sides lapping is available.
Lasermarking
Each wafer can be lasermarked with the same value, lasermarked in sequential series or any other patterns.
Etching and Films
Our polish step removes all scratches and pits from wafer surfaces. This allows multiple reclaims on each wafer, with increased cost savings.